Today I received a fat Ps2 (SCPH-50002), the system turned on but there was no picture or sound, I checked the A/V leads ect. Still nothing, so I pulled the system down and took a look at the processor, well what do you know... the problem was a cracked BGA (Ball grid array), (Saves money on manufacture but causes lots of problems), any way I went right to reflowing the chips, The reflow method for the ps2 is just the same as the ps3 BUT the chips have less sheilding on them so they take less time to reflow.
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Step 1:
Strip the ps2 down to just the motherboard **DON'T FORGET TO REMOVE THE 3v CELL BATTERY (BATTERY + 350c = BAD)**,
Step 2:
Get a heat gun and set to 350c (or low if its a cheap one just check that low = 350c-ish).
Step 3:
Cover the board in aluminum foil, and cut holes where the Emotion Engine chip is and all the other bigish bga's.
Step 4:
Sit the motherboard on a level heat proof surface.
Step 5:
Begin by heating up the heat gun, then start off preheating the board ( Hold heat gun 3ft above the board and slowley warm up the board. Then move in closer and start on the Emotion Engine Chip, Moving the heat gun in a circular motion 3inches above the chip heat for 10~15 seconds and back off the heat, Repeat for the rest of the large BGA chips, when you have finnished with the last one hold the heat gun above the board at about 4ft and back off slowley ( This is to prevent stressing the solder joints preventing dry joints), once you have backed off to about 5ft you can turn off the heat gun and leave the board to cool.
DON'T MOVE THE BOARD OR EVEN TOUCH IT FOR ATLEAST 15MINUTES THE CHIPS ARNT HELD IN BY ANYTHING MOVING CAN DESTROY THE BOARD, SO WAIT UNTILL THE BOARD IS COOL, AND EVEN THEN DONT BEND IT OR FELX IT WHILE PUTTING THE SYSTEM BACK TOGEATHER.